Influence of solder paste demoulding and forming on welding in SMT printing process

  In surface mount technology (SMT) printing, the process of removing the solder paste from the stencil and forming it onto the circuit board can have an impact on the subsequent welding process.

  One factor to consider is the consistency and accuracy of the solder paste deposition. If the solder paste is not deposited in a uniform and consistent manner, it can lead to uneven wetting during the reflow process, resulting in weak or poorly formed joints.

  Another factor to consider is the stencil design and the size and shape of the apertures in the stencil. The stencil should be designed to provide sufficient solder paste to fill the pads on the circuit board, but not so much that it causes bridging between adjacent pads.

  In addition, the paste release properties of the stencil can affect the formation of the solder joints. If the paste sticks too strongly to the stencil, it can be difficult to transfer onto the circuit board, resulting in incomplete or poorly formed joints. On the other hand, if the paste releases too easily from the stencil, it can result in excess paste being deposited onto the circuit board, which can lead to bridging and other defects.

  Overall, proper stencil design, accurate paste deposition, and good paste release properties are all important factors in ensuring high quality solder joints in SMT printing. So engineer experience is very important, Nels Tech believe that only engineers can win the hearts of clients.