Specification

GKG GSE

Substrate size (X × Y): 50×50mm ~ 400 × 340mm

Substrate thickness size 0.4~6mm

Substrate edge gap: 2.5mm

Transmission height: 900±40mm

Transmission speed: Segmentation control, speed 1500mm/s (Max)

PCB Transmission method: Substrate clamping Manually pressing, flexible side clamp

Substrate support method: Magnetic thimble, contour block, manual adjustment jacking platform

Image field of view: 8×6mm

Reference point type: Standard shape reference point, pad, opening

Camera system Up/down imaging vision system, analog camera CCD, geometric matching positioning

performance

System alignment accuracy and repeatability: ±0.01mm

Actual solder paste placement repeatability: ±0.025mm

Actual solder paste print position repeatability verified based on third-party test system (CTK, Germany)

Printing cycle: <8sec

Printing mode: single or double blade printing

Printing speed: 6~200mm/sec

Printing pressure: 0.5~10Kg

Template frame size: 370×370mm~737~737mm

Cleaning method: Enhanced vacuum adsorption, dry, wet, vacuum three modes, drip cleaning system

Power requirements: AC220V±10%, 50/60Hz, 2.5KW

Compressed air requirements: 4~6Kgf/cm2

Air consumption is about 5L/min

Working environment temperature: -20°C~+45°C

Working environment humidity: 30%~60%

Equipment size (removing three-color lamps) L1158×W1632×H1463(mm)

Weight: about 1000Kg